Method of encapsulating semiconductor devices by a direct drive

Details Method of encapsulating semiconductor devices by a direct drive Method of encapsulating semiconductor devices by a direct drive

1996-07-18

1997-07-08

Heitbrink, Jill L.

Plastic and nonmetallic article shaping or treating: processes

With measuring, testing, or inspecting

Positioning of a mold part to form a cavity or controlling...

26427217, 2643284, 425116, 425145, 425150, 425590, B29C 4502, B29C 4566, B29C 4580

Patent

active

056457766

ABSTRACT:
A method for encapsulating semiconductor devices includes the steps of: providing a molding system and a close-loop control system which is coupled to the molding system, the close-loop control system including a computer, a programmable logic control, a servo motor controller, and at least two drivers, wherein the servo motor controller is coupled to the computer and the programmable logic control, respectively, the servo motor controller is further coupled to the drivers, and the drivers are coupled to the molding system; clamping together at least one set of top and bottom molds of the molding system, the molding system including a clamping assembly having a clamping axis, the close-loop control system being coupled to the clamping assembly; feeding a molding compound into a cavity formed by a space between at least one set of top and bottom molds, the molding system further including a transfer assembly having a transfer axis; alternating a gear switching assembly of the molding system between a high speed mode and a high torque mode along the clamping axis, the gear switching assembly being coupled to the clamping assembly; and providing feedback from the close-loop control system to the clamping assembly and transfer assembly of the molding system to minimize disproportionate drive along the clamping and transfer axes, respectively.

REFERENCES:
patent: 4599062 (1986-07-01), Konishi
patent: 4820464 (1989-04-01), Sasaki et al.
patent: 4828475 (1989-05-01), Kamiguchi
patent: 4828476 (1989-05-01), Yashiharu et al.
patent: 5087190 (1992-02-01), Laghi
patent: 5176859 (1993-01-01), Leffew
patent: 5328347 (1994-07-01), Ten Vaarwek

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