Plastic and nonmetallic article shaping or treating: processes – Carbonizing to form article – Agglomeration or accretion
Patent
1989-05-16
1992-05-05
Lowe, James
Plastic and nonmetallic article shaping or treating: processes
Carbonizing to form article
Agglomeration or accretion
264236, 26427213, 26427217, B29C 4514, B29C 3508
Patent
active
051105152
ABSTRACT:
A method for manufacturing plastic package for semiconductor according to the present invention comprises the steps of: forming a mold product of plastic package for semiconductor, which contains therein a semiconductor chip, by molding resin by means of a transfer press; heating the mold product to postcure it during transportation from the transfer press to a heating chamber while the mold product is kept by heaters at a temperature higher than a glass transition temperature of the resin for a predetermined period of time; and further heating the mold product in the heating chamber while the mold product is kept at a temperature substantially equal to the glass transition temperature of the resin for another predetermined period of time.
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Hasebe Akio
Kaneda Aizo
Mitani Masao
Nakamura Shozo
Tsunoda Shigeharu
Hitachi , Ltd.
Lowe James
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