Method of encapsulating optoelectronic components

Details Method of encapsulating optoelectronic components Method of encapsulating optoelectronic components

2011-07-12

2011-07-12

Lee, Edmund H. (Department: 1744)

Plastic and nonmetallic article shaping or treating: processes

Pore forming in situ

Composite article making

C264S045400, C264S046200, C264S046300, C264S173110, C264S173140, C264S175000, C264S272140, C264S272150, C264S272190, C264S272160, C264S272210

Reexamination Certificate

active

07976750

ABSTRACT:
Method of encapsulating optoelectronic components, by embedding the components to be encapsulated between a first transparent polymer layer and a second polymer layer, which is filled with unactivated foaming agent, and then activating the foaming agent, so that the two polymer layers join to one another, in particular weld to one another, and the components are enclosed between the two polymer layers.

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