Method of encapsulating microelectronic elements

Details Method of encapsulating microelectronic elements Method of encapsulating microelectronic elements

1978-04-24

1981-02-10

Reynolds, B. A.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29588, 174 52FP, 357 72, 264272, H05K 500

Patent

active

042503477

ABSTRACT:
Method for encapsulating microelectronic elements, starting from strip-like material including a number of interconnected conductor patterns each having a number of leads for the microelectronic element to be encapsulated, which comprises applying a microelectronic element or crystal in the center of each conductor pattern, the terminal means of which are connected to the leads of the conductor pattern, after which the crystal-carrying strip-like material is so positioned in a mould that each crystal is substantially in the center of a mould cavity, which cavity is subsequently poured with an encapsulating synthetic material, wherein on each crystal-carrying conductor pattern on either side of the strip-like material a mould half provided with an aperture is placed in such a manner that the two apertures together form the mould cavity for the encapsulating material, the two mould halves serving as a permanent encapsulation for the crystal after pouring of the mould cavity.

REFERENCES:
patent: 3086149 (1963-04-01), Baron
patent: 3251015 (1966-05-01), Denham
patent: 3469684 (1969-09-01), Keady et al.
patent: 3778685 (1973-12-01), Kennedy
patent: 3838316 (1974-09-01), Brown et al.
patent: 3868725 (1975-02-01), De Graff
patent: 4066839 (1978-01-01), Cossutta et al.

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