Method of encapsulating large substrate devices using reservoir

Details Method of encapsulating large substrate devices using reservoir Method of encapsulating large substrate devices using reservoir

1994-08-11

1996-11-26

Silbaugh, Jan H.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

26427217, 264275, 425812, B29C 4514, B29C 7070, B29C 3310

Patent

active

055782612

ABSTRACT:
Reservoir cavities have been used successfully to achieve proper mold filling of large area substrate packages with severe leading and lagging of flow fronts in the cavity halves, The additional plastic required to fill the reservoir cavities and the additional work in removing the reservoir culls is minimal, Reservoir cavities have been shown to eliminate void problems in molded packages with large printed wiring board substrates,

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