Method of encapsulating electrical apparatus

Details Method of encapsulating electrical apparatus Method of encapsulating electrical apparatus

1979-03-27

1981-01-06

Lowe, James B.

Plastic and nonmetallic article shaping or treating: processes

Treatment of material by vibrating, jarring, or agitating...

264122, 264123, 264272, B29C 602

Patent

active

042436230

ABSTRACT:
A method of encapsulating electrical apparatus in a particulate filler material which is cohesively bonded together by a binder material which forms beads around the points of contact between contiguous particles. The filler material includes uncoated and dry, resin-coated particles, with the dry resin being redistributed after the particles of filler are in position about the electrical apparatus by the step of liquifying the resin coating with a liquid solvent, to form beads around the points of contact between contiguous particles.

REFERENCES:
patent: 1947085 (1934-02-01), Hill et al.
patent: 2155016 (1939-04-01), Kershaw
patent: 2941905 (1960-06-01), Hofmann
patent: 2991267 (1961-07-01), Bean
patent: 3161843 (1964-12-01), Hodges et al.
patent: 4082916 (1978-04-01), Jacklic, Jr. et al.

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