Method of encapsulating die and chip carrier

Details Method of encapsulating die and chip carrier Method of encapsulating die and chip carrier

1994-05-19

1997-09-02

Lovering, Richard D.

Metal working

Method of mechanical manufacture

Electrical device making

257791, 26427217, 438126, 438127, H01L 2156, H01L 2160

Patent

active

056631065

ABSTRACT:
A method of packaging a semiconductor chip assembly includes the encapsulation of the same after establishing an encapsulation area and providing a physical barrier for protecting the terminals of a chip carrier. An alternative or supplement to providing a physical barrier is to provide a preform of an encapsulation material which includes a predetermined volume of such material so that only the encapsulation area is filled. For a semiconductor chip assembly which does not yet have an elastomeric layer, a method of simultaneously forming such an elastomeric layer and encapsulating a semiconductor chip assembly is also provided.

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