Method of encapsulating beam lead semiconductor devices

Details Method of encapsulating beam lead semiconductor devices Method of encapsulating beam lead semiconductor devices

1974-07-15

1976-04-06

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29580, 156 17, 427 93, B01J 1700

Patent

active

039479528

ABSTRACT:
Plastic encapsulation in the form of a thin film of silicone resin is provided on the active surface of beam lead semiconductor chips by a multistep process. An etchable organic film, for example, of silicone resin, is applied to the chips while they are still in wafer form. A mask is formed on top of the resin having a pattern conforming to the underlying semiconductor chips. The exposed resin overlying the intervening beam lead grid portion is then dissolved, after which the mask is removed. The final step is the standard wafer separation which leaves each semiconductor chip with a thin silicone resin coating over the active surface thereof.

REFERENCES:
patent: 3132046 (1964-05-01), Mann
patent: 3193418 (1965-07-01), Cooper
patent: 3458351 (1969-07-01), Held
patent: 3466741 (1969-09-01), Wiesner
patent: 3550261 (1970-12-01), Schroeder
patent: 3590478 (1971-07-01), Takehanna
patent: 3750269 (1973-08-01), Small
patent: 3771219 (1973-11-01), Tuzi

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