Method of encapsulating an electronic component with a synthetic

Details Method of encapsulating an electronic component with a synthetic Method of encapsulating an electronic component with a synthetic

1986-12-18

1989-04-18

Lowe, James

Plastic and nonmetallic article shaping or treating: processes

Carbonizing to form article

Agglomeration or accretion

264 14, 26427217, 437211, B29C 3508, B29C 4328

Patent

active

048225363

ABSTRACT:
A method using one or several successive coatings of an active device (63), (64) by means of a synthetic resin (72);
the resin used is on the basis of a product of the family of ethoxy bisphenol A dimethacrylates, to which is added a photo-initiator compound producing radicals by photo-scission or by intermolecular abstraction of hydrogen at a concentration lying between 0.2 and 3% and preferably near 1%, which is then irradiated by ultra-violet radiation (76), as the case may be through a transparent mould (70);
Application: coating of semiconductor devices and more particularly optoelectronic devices.

REFERENCES:
patent: 4034466 (1977-07-01), Thome
patent: 4203792 (1980-05-01), Thompson
patent: 4477328 (1984-10-01), Broeksema et al.

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