Method of encapsulating an electronic component

Details Method of encapsulating an electronic component Method of encapsulating an electronic component

2009-11-12

2011-11-29

Arbes, Carl (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S827000, C029S832000, C029S833000, C029S840000

Reexamination Certificate

active

08065793

ABSTRACT:
An application method for resin includes applying resin to a first electronic component in an application chamber under a first internal pressure, moving a second electronic component into an internal pressure adjustment chamber under a second internal pressure which is higher than the first internal pressure and adjusting an internal pressure of the internal pressure adjustment chamber from the second internal pressure to the first internal pressure, and moving the second electronic component into the application chamber while moving the first electronic component into the internal pressure adjustment chamber after the step of application of the resin has been completed.

REFERENCES:
patent: 4222516 (1980-09-01), Badet et al.
patent: 4709254 (1987-11-01), Haghiri-Tehrani et al.
patent: 4803542 (1989-02-01), Haghiri-Tehrani et al.
patent: 5367766 (1994-11-01), Burns et al.
patent: 5416358 (1995-05-01), Ochi et al.
patent: 5520863 (1996-05-01), Ochi et al.
patent: 6782612 (2004-08-01), Chiu
patent: 2000-195882 (2000-07-01), None

Affiliated with

Also associated with

Rating

Method of encapsulating an electronic component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of encapsulating an electronic component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of encapsulating an electronic component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4256914