Method of encapsulating an assembly with a low temperature...

Details Method of encapsulating an assembly with a low temperature... Method of encapsulating an assembly with a low temperature...

2007-03-06

2007-03-06

Hoang, Quoc (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C257S791000, C257SE21449, C174S050510, C174S657000

Reexamination Certificate

active

11165230

ABSTRACT:
A method for encapsulating an assembly with a methyl phenyl silicone rubber compound is provided. In various embodiments, the method can include exposing the assembly to a solvent, plasma etching the assembly, and producing a potting mixture, wherein the potting mixture comprises a methyl phenyl room temperature vulcanization silicone and a curing agent. The method can further include pouring the potting mixture over the assembly while under a vacuum until the assembly is encapsulated, pouring at least two control samples of the potting mixture while under the vacuum, curing the encapsulated assembly and the control samples in a first environment and monitoring the one of the control samples for hardness, and determining whether additional cure time in the first environment is needed based upon the results of the control sample hardness tests.

REFERENCES:
patent: 6987058 (2006-01-01), Hall

Affiliated with

Also associated with

Rating

Method of encapsulating an assembly with a low temperature... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of encapsulating an assembly with a low temperature..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of encapsulating an assembly with a low temperature... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3792477