Method of encapsulating a wire bonded die

Details Method of encapsulating a wire bonded die Method of encapsulating a wire bonded die

1997-12-16

2000-02-08

Parker, Fred J.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427256, 427282, 427287, B05D 126, B05D 512

Patent

active

060225831

ABSTRACT:
A method of dispensing encapsulant material on a wire bonded die comprises dispensing a series of discrete, single-point droplets and a series of continuous beads within an area bounded by a dam. The encapsulant material spreads out from the droplets and the continuous beads to form an encapsulating layer over the wire bonded die in an area defined by the dam.

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