Method of encapsulating a sensor into a panel body

Details Method of encapsulating a sensor into a panel body Method of encapsulating a sensor into a panel body

1996-04-01

1998-06-09

Ortiz, Angela Y.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

264255, 26427213, B29C 3502, B29C 4120

Patent

active

057628530

ABSTRACT:
A flexible sensor, such as a membrane switch, is molded into a plastic automotive panel by a low temperature, low pressure, method which avoids damage to the switch while insuring its placement at a desired depth below the surface of the panel. This is achieved by a process which includes a first step of spraying a mold with a rapid gelling liquid plastic to a preselected thickness. After the plastic has firmed, the sensor is placed thereon and is encapsulated by spraying with a second layer of the plastic. The resulting shell with the embedded sensor may then be provided with a backing, such as a plastic foam.

REFERENCES:
patent: 3312197 (1967-04-01), Smith
patent: 3819205 (1974-06-01), Dunford et al.
patent: 4228115 (1980-10-01), Gardner et al.
patent: 4310174 (1982-01-01), Sundeen et al.
patent: 4320573 (1982-03-01), Larson
patent: 4325568 (1982-04-01), Clark et al.
patent: 4410387 (1983-10-01), Halkerston et al.
patent: 4934735 (1990-06-01), Embach
patent: 5002306 (1991-03-01), Hiramitsu et al.
patent: 5062661 (1991-11-01), Winget
patent: 5071683 (1991-12-01), Verwilst et al.
patent: 5073318 (1991-12-01), Rohrlach et al.
patent: 5085462 (1992-02-01), Gualtier
patent: 5098630 (1992-03-01), Ogiu et al.
patent: 5186490 (1993-02-01), Adams et al.
patent: 5193412 (1993-03-01), Hashiba
patent: 5198629 (1993-03-01), Hayashi et al.
patent: 5492586 (1996-02-01), Gorczyca
patent: 5510074 (1996-04-01), Rose
SAE Technical Paper Series, "A Production Proven Polyurethane Skin Technology for Interior Trim Parts", T. Karwan et al., 4 pgs., Feb-Mar. 1995.

Affiliated with

Also associated with

Rating

Method of encapsulating a sensor into a panel body does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of encapsulating a sensor into a panel body, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of encapsulating a sensor into a panel body will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2195351