Method of encapsulating a semiconductor element using a resin mo

Details Method of encapsulating a semiconductor element using a resin mo Method of encapsulating a semiconductor element using a resin mo

1990-09-17

1991-12-31

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

249 95, 26427217, H01L 2156, H01L 2158

Patent

active

050772376

ABSTRACT:
A semiconductor sealing mold for sealing a semiconductor element within a thermosetting resin is provided with resin inflow openings formed in oppositely and substantially symmetrically opposed relation to the active surface and back surface of a lead frame connected semiconductor element. As a result, the application of the molding process and method of encapsulation of the semiconductor element can be accomplished under conditions of uniformly applied pressure to opposite surfaces of the semiconductor element and extending outwardly in all radial directions from the center of the semiconductor element. Furthermore, since the bonding wires and lead frame leads are substantially aligned in the same radial directions from the center of the semiconductor element, damage does not occur to these wires or leads during the molding process.

REFERENCES:
patent: 4043027 (1977-08-01), Birchler et al.

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