Method of encapsulating a semiconductor device with a flame reta

Details Method of encapsulating a semiconductor device with a flame reta Method of encapsulating a semiconductor device with a flame reta

1989-10-05

1991-08-20

Lowe, James

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

26433112, B29C 4514

Patent

active

050412540

ABSTRACT:
An improved flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the polyglycidyl ether of the bromophenol-formaldehyde novolac type, preferably containing at least about 1.0% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.01-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of from about 0.4 to about 0.8% by weight of the molding compound, and an amount of bismuth trioxide from about 1.6 to about 4.0% by weight of the molding compound. The improved flame retardant epoxy compounds when used to encapsulated semiconductor devices have improved high temperature stability and compatability, ball-lift performance, live-device performance, cost and lower toxicity compared to similar prior art molding compounds.

REFERENCES:
patent: 4282136 (1981-08-01), Hunt et al.

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