Method of encapsulating a photoflash lamp using a powdered resin

Details Method of encapsulating a photoflash lamp using a powdered resin Method of encapsulating a photoflash lamp using a powdered resin

1983-07-18

1985-02-12

Lowe, James

Electric lamp or space discharge component or device manufacturi

Process

With assembly or disassembly

264138, 264162, 26427216, 362 13, 431359, 431360, B29C 604, H05B 4132

Patent

active

044988834

ABSTRACT:
A method of forming a protective coating on a glass envelope of a photoflash lamp. The method comprises the steps of orienting the lamp within a mold member such that the external surfaces of the lamp's glass envelope do not contact the internal surfaces of the mold, depositing a quantity of powdered thermoplastic or thermosetting resin within the mold such that the resin surrounds the entirety of the glass envelope's external surfaces, simultaneously applying pressure and heat to the powdered material to cause it to liquify, and thereafter cooling the liquified material to form a light-transmitting, solid polymer member having the glass envelope located therein. Pressures within the range of about 500 to 8000 pounds per square inch were possible without fracturing the glass envelopes or adversely effecting the components therein. The finished product is ideally suited as one component of a multilamp photoflash device for use with many of today's cameras.

REFERENCES:
patent: 3194953 (1965-07-01), Friedland
patent: 3315071 (1967-04-01), Pfefferle
patent: 3322992 (1967-05-01), Parker et al.
patent: 3352953 (1967-11-01), Zavitz et al.
patent: 3612850 (1971-10-01), Nijland
patent: 3860740 (1975-01-01), Watkins
patent: 3992136 (1976-11-01), Shaffer
patent: 4200901 (1980-04-01), Shaffer et al.

Affiliated with

Also associated with

Rating

Method of encapsulating a photoflash lamp using a powdered resin does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of encapsulating a photoflash lamp using a powdered resin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of encapsulating a photoflash lamp using a powdered resin will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1387665