Method of enabling selective area plating on a substrate

Details Method of enabling selective area plating on a substrate Method of enabling selective area plating on a substrate

2011-04-12

2011-04-12

Meeks, Timothy H (Department: 1715)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S097300, C427S098400, C427S098500, C427S282000

Reexamination Certificate

active

07923059

ABSTRACT:
A method of enabling selective area plating on a substrate includes forming a first electrically conductive layer (310) over substantially all of the substrate, covering sections of the first electrically conductive layer with a mask (410) such that the first electrically conductive layer has a masked portion and an unmasked portion, forming a second electrically conductive layer (710, 1210), the second electrically conductive layer forming only over the unmasked portion of the first electrically conductive layer, and removing the mask and the masked portion of the first electrically conductive layer. In an embodiment, the mask covering sections of the first electrically conductive layer is a non-electrically conductive substance (1010) applied with a stamp (1020). In an embodiment, the mask is a black oxide layer.

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patent: 6998339 (2006-02-01), Ito
patent: 2006/0070769 (2006-04-01), Kim
patent: 2006-274369 (2006-10-01), None
International Search Report and Written Opinion for PCT Patent Application No. PCT/US2008/077612, Mailed Mar. 24, 2009, 11 Pages.
International Preliminary Report on Patentability, for PCT Application No. PCT/US2008/077612, Mailed on Apr. 8, 2010, 6 pages.
Omar J. Bchir, et al., “Method of Removing Unwanted Plated or Conductive Material From a Substrate, and Method of Enabling Metallization of a Substrate Using Same”, filed Aug. 13, 2007 as U.S. Appl. No. 11/838,057.

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