Method of embedding semiconductor components in plastics

Details Method of embedding semiconductor components in plastics Method of embedding semiconductor components in plastics

1980-03-05

1982-11-09

Wityshyn, Michael G.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562757, 156298, 1563031, 1563073, 26427211, 26427213, 26427214, 26427217, B29C 2500, B29C 2700

Patent

active

043583318

ABSTRACT:
A method of embedding semiconductor components in plastics comprising inserting components into the plastics material and thereafter hardening the plastics material by irradiation with high energy beams.

REFERENCES:
patent: 3081244 (1963-03-01), Campanile
patent: 3644161 (1972-02-01), Hall
patent: 3697351 (1972-10-01), Harmer et al.
patent: 4268339 (1981-05-01), Urban
Kunstoffhandbuch (Manual of Plastics), vol. I, Hanser-Verlag, Wien, (1975), pp. 1164-1165.
SPI Plastics Engineering Handbook, 4th Edition, Van Nostrand Reinhold Co., New York, (1976), pp. 600-605.

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