Method of embedding passive component within via

Details Method of embedding passive component within via Method of embedding passive component within via

2007-10-02

2007-10-02

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S025420, C029S592100, C029S832000, C029S833000, C029S834000, C029S842000, C174S050510, C174S261000, C174S262000, C257S774000, C257S916000, C257SE23067, C361S321300, C361S760000

Reexamination Certificate

active

10815464

ABSTRACT:
A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.

REFERENCES:
patent: 6446317 (2002-09-01), Figueroa et al.
patent: 2002/0100612 (2002-08-01), Crockett et al.
patent: 2004/0113752 (2004-06-01), Schuster

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