Method of embedding passive component within via

Details Method of embedding passive component within via Method of embedding passive component within via

2011-05-31

2011-05-31

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S773000

Reexamination Certificate

active

07952202

ABSTRACT:
A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.

REFERENCES:
patent: 6446317 (2002-09-01), Figueroa et al.
patent: 2002/0017399 (2002-02-01), Chang et al.
patent: 2002/0100612 (2002-08-01), Crockett et al.
patent: 2002/0105774 (2002-08-01), Wermer et al.
patent: 2004/0113752 (2004-06-01), Schuster
patent: 2005/0224989 (2005-10-01), Myers et al.

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