Method of embedding optical fiber in multilayer printed...

Details Method of embedding optical fiber in multilayer printed... Method of embedding optical fiber in multilayer printed...

2005-06-14

2005-06-14

Haran, John T. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S153000, C156S272200, C385S014000

Reexamination Certificate

active

06905569

ABSTRACT:
There is disclosed a method of embedding an optical fiber in the miltilayer printed circuit board without causing chemical or thermal damage to the optical fiber, in which a groove is formed on a substrate consisting of a dielectric substrate layer having a conductive layer formed on one side thereof, for example by a router bit process, the optical fiber is embedded in the groove using an adhesive liquid to give a optical substrate, and then at least one printed circuit board is laminated on and under the single optical substrate or the layered structure of two or more of the optical substrate.

REFERENCES:
patent: 5985086 (1999-11-01), Peall
patent: 6005991 (1999-12-01), Knasel
patent: 6099684 (2000-08-01), Dannoux
patent: 6181854 (2001-01-01), Kojima et al.
patent: 6233376 (2001-05-01), Updegrove
patent: 6370292 (2002-04-01), Strake
patent: 6788859 (2004-09-01), Markovich et al.
patent: 6829413 (2004-12-01), Brooks et al.
patent: 2002/0131727 (2002-09-01), Reedy et al.

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