Method of eliminating curl for devices on thin flexible...

Details Method of eliminating curl for devices on thin flexible... Method of eliminating curl for devices on thin flexible...

2007-02-13

2007-02-13

Coleman, W. David (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C438S019000, C136S245000

Reexamination Certificate

active

11339764

ABSTRACT:
A thin film semiconductor device such as a photovoltaic device is fabricated on a lightweight substrate material which is affixed to a layer of material which is in turn supported by a carrier. Following the fabrication of the device, the carrier is removed such as by an etching process, leaving the layer of material adhered to the substrate. The adhered layer provides a balancing force to the back side of the substrate which minimizes or eliminates the tendency of the semiconductor device supported on the opposite side of the substrate to cause the substrate to curl. Also disclosed are devices and structures made by this method.

REFERENCES:
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patent: 4788846 (1988-12-01), Morita et al.
patent: 5090356 (1992-02-01), Nath et al.
patent: 6362020 (2002-03-01), Shimoda et al.
patent: 6767762 (2004-07-01), Guha
patent: 6946361 (2005-09-01), Takayama et al.
patent: 2004/0224436 (2004-11-01), Naito

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