Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Controlling current distribution within bath
Reexamination Certificate
2011-06-28
2011-06-28
Neckel, Alexa D (Department: 1723)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Controlling current distribution within bath
C204SDIG012, C205S096000, C205S123000
Reexamination Certificate
active
07967969
ABSTRACT:
A substantially uniform layer of a metal is electroplated onto a work piece having a seed layer thereon. This is accomplished by employing a “high resistance ionic current source,” which solves the terminal problem by placing a highly resistive membrane (e.g., a microporous ceramic or fretted glass element) in close proximity to the wafer, thereby swamping the system's resistance. The membrane thereby approximates a constant current source. By keeping the wafer close to the membrane surface, the ionic resistance from the top of the membrane to the surface is much less than the ionic path resistance to the wafer edge, substantially compensating for the sheet resistance in the thin metal film and directing additional current over the center and middle of the wafer.
REFERENCES:
patent: 3652442 (1972-03-01), Powers et al.
patent: 3706651 (1972-12-01), Leland
patent: 3862891 (1975-01-01), Smith
patent: 4033833 (1977-07-01), Bestel et al.
patent: 4082638 (1978-04-01), Jumer
patent: 4240886 (1980-12-01), Hodges et al.
patent: 4272335 (1981-06-01), Combs
patent: 4304641 (1981-12-01), Grandia et al.
patent: 4389297 (1983-06-01), Korach
patent: 4409339 (1983-10-01), Matsuda et al.
patent: 4469564 (1984-09-01), Okinaka et al.
patent: 4545877 (1985-10-01), Hillis
patent: 4604177 (1986-08-01), Sivilotti
patent: 4604178 (1986-08-01), Fiegener et al.
patent: 4605482 (1986-08-01), Shirgami et al.
patent: 4696729 (1987-09-01), Santini
patent: 4828654 (1989-05-01), Reed
patent: 4906346 (1990-03-01), Hadersbeck et al.
patent: 4931149 (1990-06-01), Stierman et al.
patent: 4933061 (1990-06-01), Kulkarni et al.
patent: 4988417 (1991-01-01), DeYoung
patent: 5035784 (1991-07-01), Anderson et al.
patent: 5039381 (1991-08-01), Mullarkey
patent: 5096550 (1992-03-01), Mayer et al.
patent: 5146136 (1992-09-01), Ogura et al.
patent: 5156730 (1992-10-01), Bhatt et al.
patent: 5162079 (1992-11-01), Brown
patent: 5217586 (1993-06-01), Datta et al.
patent: 5316642 (1994-05-01), Young, Jr. et al.
patent: 5332487 (1994-07-01), Young et al.
patent: 5368711 (1994-11-01), Poris
patent: 5391285 (1995-02-01), Lytle et al.
patent: 5421987 (1995-06-01), Tzanavaras et al.
patent: 5443707 (1995-08-01), Mori
patent: 5472592 (1995-12-01), Lowery
patent: 5476578 (1995-12-01), Forand
patent: 5498325 (1996-03-01), Nishimura et al.
patent: 5516412 (1996-05-01), Andricacos et al.
patent: 5567300 (1996-10-01), Datta et al.
patent: 5723028 (1998-03-01), Poris
patent: 5935402 (1999-08-01), Fanti
patent: 6027631 (2000-02-01), Broadbent
patent: 6126798 (2000-10-01), Reid et al.
patent: 6132587 (2000-10-01), Jorne et al.
patent: 6179983 (2001-01-01), Reid et al.
patent: 6193860 (2001-02-01), Weling
patent: 6251255 (2001-06-01), Copping et al.
patent: 6368475 (2002-04-01), Hanson et al.
patent: 6391166 (2002-05-01), Wang
patent: 6391188 (2002-05-01), Goosey
patent: 6395152 (2002-05-01), Wang
patent: 6402923 (2002-06-01), Mayer et al.
patent: 6497801 (2002-12-01), Woodruff et al.
patent: 6527920 (2003-03-01), Mayer et al.
patent: 6755954 (2004-06-01), Mayer et al.
patent: 6773571 (2004-08-01), Mayer et al.
patent: 6821407 (2004-11-01), Reid et al.
patent: 6964792 (2005-11-01), Mayer et al.
patent: 7070686 (2006-07-01), Contolini et al.
patent: 7169705 (2007-01-01), Ide et al.
patent: 7622024 (2009-11-01), Mayer et al.
patent: 2002/0017456 (2002-02-01), Graham et al.
patent: 2002/0020627 (2002-02-01), Kunisawa et al.
patent: 2003/0029527 (2003-02-01), Yajima et al.
patent: 2003/0102210 (2003-06-01), Woodruff et al.
patent: 2007/0238265 (2007-10-01), Kurashina et al.
patent: 0037325 (1981-03-01), None
patent: 59-162298 (1984-09-01), None
patent: 09-53197 (1997-02-01), None
patent: 20021316887 (2001-11-01), None
patent: 2003-268591 (2003-09-01), None
patent: 10-0707121 (2007-04-01), None
patent: WO/9941434 (1999-08-01), None
Fang et al., “Uniform Copper Electroplating on Resistive Substrates,” Abs. 167, 205thMeeting, © 2004 The Electrochemical Society, Inc., 1 page.
Steven t. Mayer, “Uniform Electroplating Of Thin Metal Seeded Wafers Using Rotationally Asymmetric Variable Anode Correction”, U.S. Appl. No. 10/916,374, filed Aug. 10, 2004.
Mayer et al., “Copper Electroplating Method And Apparatus”, U.S. Appl. No. 10/318,497, filed May 10, 2000.
Mayer et al., Electrochemical Treatment of Integrated Circuit Substrates Using Concentratic Anodes and Variable Field Shaping Elements, U.S. Appl. No. 10/116,077, filed Apr. 2, 2002.
U.S. Office Action for U.S. Appl. No. 11/040,359 mailed Oct. 26, 2007.
Final Office Action for U.S. Appl. No. 11/040,359 mailed Jul. 25, 2008.
U.S. Office Action for U.S. Appl. No. 11/040,359 mailed Jan. 8, 2009.
Notice of Allowance and Allowed Claims for U.S. Appl. No. 11/040,359 mailed Jul. 20, 2009.
Malmstadt et al. “Microcomputers and Electronic Instrumentation: Making the Right Connections” American Chemical Society (1994) p. 255.
International Search Report and Written Opinion for Application No. PCT/US2010/037520 dated Jan. 12, 2011.
Mayer Steven T.
Reid Jonathan D.
Leader William T
Neckel Alexa D
Novellus Systems Inc.
Weaver Austin Villeneuve & Sampson
LandOfFree
Method of electroplating using a high resistance ionic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of electroplating using a high resistance ionic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of electroplating using a high resistance ionic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2664041