Method of electroplating tin and alkaline electroplating bath th

Details Method of electroplating tin and alkaline electroplating bath th Method of electroplating tin and alkaline electroplating bath th

1980-02-11

1981-02-24

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 360

Patent

active

042526183

ABSTRACT:
An improved electroplating process and electroplating bath therefor is disclosed which is adapted to electrodeposit a tin-bismuth alloy. The electroplating bath contains tin ions, an alkali metal hydroxide, and bismuth citrate. Bismuth citrate exhibits relatively high solubility in hot alkaline alkali metal stannate electroplating baths when compared to conventional alkali metal bismuthates or other bismuth compounds which in general have poor solubility in hot alkali metal stannate electroplating baths. An improved process is provided for electrodepositing a tin-bismuth alloy on panels as adherent and uniform plates without signs of staining or tin-bismuth nodules. An additional and important feature of this invention is the advantageous blending of the bismuth citrate with the alkalic metal stannate in the dry solid state, if and when desired.

REFERENCES:
patent: 3360446 (1967-12-01), Jongkind
patent: 3522155 (1970-07-01), Dow
patent: 4162205 (1979-07-01), Wilson et al.

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