Method of electroplating tin and alkaline electroplating bath th

Details Method of electroplating tin and alkaline electroplating bath th Method of electroplating tin and alkaline electroplating bath th

1978-10-19

1979-07-24

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

260447, 2603435, C25D 360

Patent

active

041622057

ABSTRACT:
An improved electrotinplating process and electroplating bath therefor is disclosed. The electroplating bath contains tin ions, an alkali metal hydroxide, and a bismuth compound selected from the group consisting of at least one alkali metal bismuth salt of a linear polyhydroxymonocarboxylic acid having at least six carbon atoms, at least one alkali metal bismuthyl compound of glucono-delta-lactone, and mixtures thereof. The alkali metal bismuth compounds of this invention exhibit increased solubility and long-term stability in hot alkaline alkali metal stannate electroplating baths when compared to conventional alkali metal bismuthates. A preferred alkali metal bismuth compound is an alkali metal bismuthyl gluconate. An improved electrotinplating process is therefore provided which produces a plated tin-bismuth alloy which is resistant to the effects of tin pest.

REFERENCES:
patent: 3360446 (1967-12-01), Jongkind
patent: 3522155 (1970-07-01), Dow
patent: 3663384 (1972-05-01), Lescure

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