Method of electroplating stressed metal springs

Details Method of electroplating stressed metal springs Method of electroplating stressed metal springs

2007-01-23

2007-01-23

Fletcher, III, William Phillip (Department: 1762)

Coating processes

Nonuniform coating

Applying superposed diverse coatings or coating a coated base

C427S373000, C427S383100

Reexamination Certificate

active

11012526

ABSTRACT:
A novel method of forming a released metal spring structure is described. In the method, a release layer including a blowing agent is deposited, usually printed, over portions of a substrate. A metal film is deposited over both the release layer and the substrate. The release layer is then heated such that the blowing agent decomposes releasing a portion of the metal film. The metal film curls out of the plane of the substrate to form a spring structure.

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Nitto Denko America: REVALPHA thermal release tape © 2001-2006 Nitto Denko-Corporation URL http://www.nittousa.com/products/electronic/revalpha.php.
Nitto Denko America: Tape ELEP holder for protection or fixing of semiconducting wagers in the backgrind process © 2001-2006 Nitto Denko-Corporation URL http://www.nittousa.com/products/electronic/elep—back.php.
Nitto Denko America: Tape ELEP holder for protection or fixing semiconducting wagers in the dicing process © 2001-2006 Nitto Denko-Corporation URL http://www.nittousa.com/products/electronic/elep—dice.php.

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