Method of electroplating semicoductor wafer using variable curre

Details Method of electroplating semicoductor wafer using variable curre Method of electroplating semicoductor wafer using variable curre

1999-09-09

2000-08-29

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly semiconductor substrate

205 95, 205 96, 205137, 205159, 205915, C25D 712, C25D 516, C25D 500, C25D 904

Patent

active

061103462

ABSTRACT:
In electroplating a metal layer on a semiconductor wafer, the resistive voltage drop between the edge of the wafer, where the electrical terminal is located, and center of the wafer causes the plating rate to be greater at the edge than at the center. As a result of this so-called "terminal effect", the plated layer tends to be concave. This problem is overcome by first setting the current at a relatively low level until the plated layer is sufficiently thick that the resistive drop is negligible, and then increasing the current to improve the plating rate. Alternatively, the portion of the layer produced at the higher current can be made slightly convex to compensate for the concave shape of the portion of the layer produced at the lower current. This is done by reducing the mass transfer of the electroplating solution near the edge of the wafer to the point that the electroplating process is mass transfer limited in that region. As a result, the portion of the layer formed under these conditions is thinner near the edge of the wafer.

REFERENCES:
patent: 4304461 (1981-12-01), Grandia et al.
patent: 4624749 (1986-11-01), Black et al.
patent: 5437777 (1995-08-01), Kishi
patent: 5670034 (1997-09-01), Lowery
patent: 5744019 (1998-04-01), Ang
patent: 5873992 (1999-02-01), Glezen et al.

Affiliated with

Also associated with

Rating

Method of electroplating semicoductor wafer using variable curre does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of electroplating semicoductor wafer using variable curre, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of electroplating semicoductor wafer using variable curre will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1245969