Method of electroplating precious metals in localized areas

Details Method of electroplating precious metals in localized areas Method of electroplating precious metals in localized areas

1975-08-06

1977-01-04

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 43G, 204 46G, 204 47, 204275, C25D 502

Patent

active

040010937

ABSTRACT:
A method of electroplating precious metal in localized areas. The deposits obtained are usually nonuniform and limited to only those areas where coating is actually required thus offering considerable economic savings. The method uses shaped anodes approaching the cathodes very closely, high parallel flow rates of electrolyte and high current densities of at least 100 milliamperes per cm..sup.2 in order to electroplate the precious metal quickly. The preferred precious metal is gold. The method is applied to the coating of electronic circuits and components such as connectors and switches.

REFERENCES:
patent: R28267 (1974-12-01), Rackus et al.
patent: 2088498 (1937-07-01), Tull
patent: 3644181 (1972-02-01), Donaldson
Frederick A. Lowenheim, "Modern Electroplating", pp. 208-209, (1963).

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