Method of electroplating lead pins of integrated circuit package

Details Method of electroplating lead pins of integrated circuit package Method of electroplating lead pins of integrated circuit package

1994-02-18

1995-10-17

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437925, 257690, 257693, 257697, H01L 2160

Patent

active

054591023

ABSTRACT:
Disclosed is a method of producing an integrated circuit package, wherein portions of The package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins in corresponding one of openings formed in a plating jig made of an electrically conductive material for thereby bringing a side surface of each of the lead pins in contact with the jig. The portions of the package are electroplated under the condition where each of the lead pins is held in conduction. After the electroplating, each of the lead pins is separated from the jig through movement in the direction differing from an axial direction of each of the lead pins. Various jigs used for carrying out the above method are also disclosed.

REFERENCES:
patent: 4362991 (1982-12-01), Carbine
patent: 5022976 (1991-06-01), Roll et al.
patent: 5087331 (1992-02-01), Roll et al.
patent: 5240588 (1993-08-01), Uchida
patent: 5342992 (1994-08-01), Noto

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