Method of electroplating interconnections

Chemistry: electrical and wave energy – Processes and products

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Details

29577R, 29628, C25D 502, B01J 1700

Patent

active

040885461

ABSTRACT:
A method of forming interconnections is described wherein small gaps between contacts are bridged by electroplating metal onto both contacts to form a conductive path therebetween. Many interconnections may be made simultaneously between adjacent contacts by bridging the gap with metal by electroplating.

REFERENCES:
patent: 2834723 (1958-05-01), Robinson
patent: 3805375 (1974-04-01), La Combe et al.
patent: 3903590 (1975-09-01), Yokogawa
patent: 3950233 (1976-04-01), Rosvold

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