Method of electroplating glare-free nickel deposits

Details Method of electroplating glare-free nickel deposits Method of electroplating glare-free nickel deposits

1996-10-25

1999-04-27

Gorgos, Kathryn L.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

205273, 205274, 205276, C25D 312

Patent

active

058977635

ABSTRACT:
A method of electrodepositing nickel and nickel alloys on a metal surface of a substrate wherein a Watts or other nickel deposition electrolyte is used as the bath in the presence of a conventional base brightener. According to the invention, an ethylene-oxide adduct or propylene-oxide adduct or ethyleneoxide/propylene-oxide adduct is added in an amount less than 5 mg/l and the deposition is carried out at 40 to 75.degree. C. and the concentration of the adduct and the temperature are so selected that during operation and with visual inspection there is no cloudiness nor any diffuse scattering of light incident upon the bath.

REFERENCES:
patent: 2238861 (1941-04-01), Lind et al.
patent: 3023151 (1962-02-01), Strauss et al.
patent: 3839165 (1974-10-01), Strauss et al.
patent: 3839166 (1974-10-01), Michael
patent: 3865702 (1975-02-01), Immel et al.
George DiBAri ("Nickel Plating", Metal Finishing, v. 82, In. 1A, Jan. 1984).
WPIDSabstract of JP 61238993 (Daiichi Kogyo), Oct. 24, 1986.
JAPIO abstract of JP61238993 (Daiichi Kogyo), Oct. 24, 1986.
WPIDS abstract of JP62205041 (Nisso Yuka), Sep. 9, 1987.
Abstract of JP56152988 (Koura N.), Nov. 26, 1981.

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