Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate
2007-06-29
2010-12-28
Fletcher, III, William Phillip (Department: 1715)
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
C427S230000
Reexamination Certificate
active
07858146
ABSTRACT:
Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.
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Goosey et al., “An introduction to high performance laminates and the importance of using optimized chemical processes in PCB fabrication,” Circuit World 30/4, 2004, pp. 34-39.
Goosey et al.; “An introduction to high performance laminates and the importance of using optimized chemical processes in PCB fabrication”; Circuit World 30/4; 2004; pp. 34-39.
Bass Kevin
Cobley Andrew J.
Poole Mark A.
Singh Amrik
Fletcher, III William Phillip
Piskorski John J.
Rohm and Haas Electronic Materials LLC
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