Method of electroless plating employing plasma treatment

Details Method of electroless plating employing plasma treatment Method of electroless plating employing plasma treatment

1984-11-28

1986-02-04

Pianalto, Bernard D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 427123, 427125, 427305, 427328, 4274431, 4274432, B05D 306

Patent

active

045685622

ABSTRACT:
A method for electroless overplating of a conductive metal on printed wiring circuitry components mounted upon a plastic substrate which eliminates deposit metal overgrowth upon the plastic substrate and plastic bonding materials. The substrate and printed wiring are treated by exposure to a tetrafluoromethane plasma environment to chemically passivate, or neutralize, the plastic or adhesive substrate surface areas prior to electroless plating of the printed circuitry elements, thus preventing the establishment of catalyzing ions on the plastic or adhesive surfaces and subsequent lay down of the deposited metal thereon.

REFERENCES:
patent: 4096043 (1978-06-01), DeAngelo
patent: 4151313 (1979-04-01), Waijima
patent: 4232060 (1980-11-01), Mallory, Jr.
patent: 4278435 (1981-07-01), Ebneth

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