Method of electroforming on a metal substrate

Details Method of electroforming on a metal substrate Method of electroforming on a metal substrate

1975-04-29

1976-02-17

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 9, 204 33, 2041415, C25D 100, C25D 102, C25D 544

Patent

active

039390462

ABSTRACT:
A metal article is produced by: (1) providing an aluminum master substrate, the surface of which may be smooth or patterned; (2) making the aluminum master substrate cathodic, in an acid or acid salt solution which will not etch aluminum, at a current density of between about 10 to 500A/sq. ft., at solution temperatures of up to about 50.degree.C; (3) coating the surface of the aluminum master substrate with a thin metal layer and (4) dissolving the aluminum master substrate, to provide a metal foil article that is a negative duplicate of the smooth or patterned aluminum master substrate surface.

REFERENCES:
patent: 880484 (1908-02-01), Edison
patent: 1515658 (1924-11-01), Cole
patent: 2433441 (1947-12-01), Davidoff
patent: 3326782 (1967-06-01), Kendrick et al.
patent: 3627654 (1971-12-01), Petit et al.

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