Method of electrically interconnecting a laminated printed circu

Details Method of electrically interconnecting a laminated printed circu Method of electrically interconnecting a laminated printed circu

1985-07-29

1987-02-24

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29830, 29843, 156 92, 1562739, 361414, H05K 346

Patent

active

046446435

ABSTRACT:
A method for electrically interconnecting a laminated printed circuit structure comprises the steps of inserting a solder-plated connecting conductor pin into a through hole bored through overlying interconnecting sections of the respective printed circuit sheets, applying pressure to both ends of the pin to compress and thicken the pin, and passing an electric current through the pin to solder the pin and the respective interconnecting sections to one another at the inner peripheral surface of the through hole.

REFERENCES:
patent: 3264524 (1966-08-01), Dahlgren et al.
patent: 3281923 (1966-11-01), Best et al.
Abolafia, O. R. & Powell, D. O., Multilayer Metalized Ceramic Substrate, IBM Tech. Disclosure Bulletin, vol. 21, No. 12, May 1979, p. 4796.

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