Method of drying semiconductor wafers using hot deionized water

Details Method of drying semiconductor wafers using hot deionized water Method of drying semiconductor wafers using hot deionized water

1997-08-05

1999-11-16

Niebling, John F.

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

438906, 134 12, 134 251, 134 254, B02B 600, C25F 100, C25F 330, C25F 500

Patent

active

059839074

ABSTRACT:
Methods for drying semiconductor wafers following a chemical cleaning process utilize both a hot deionized water bath and medium-wavelength infrared light drying techniques. A preferred method comprises the steps of (a) maintaining a body of hot deionized water in a bath; (b) submerging multiple wafers to be dried in the body of hot deionized water in said bath; (c) slowly pushing said multiple wafers up through the surface of the body of hot deionized water in said bath; (d) providing an infrared bath containing an infrared lamp; and (e) transferring said multiple wafers to said infrared bath for drying.

REFERENCES:
patent: 4663820 (1987-05-01), Ionescu
patent: 4902350 (1994-02-01), Steck
patent: 4977688 (1990-12-01), Roberson et al.
patent: 5315766 (1994-05-01), Roberson, Jr. et al.
patent: 5317778 (1994-06-01), Kudo et al.
patent: 5776296 (1993-07-01), Matthews
Patent Abstracts of Japan, vol. 014, No. 387 (E-0967) Aug. 21, 1990.
The Evolution of Silicon Wafer Cleaning; Werner Kern; J. Electrochem. Soc., vol. 137, No. 6, Jun. 1990, The Electrochemical Society, Inc.
Dry Wafers Cleanly: Without Spinning; Kathy Skidmore; Semiconductor International; Jul. 1989.

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