Method of double-side lapping a wafer and an apparatus therefor

Details Method of double-side lapping a wafer and an apparatus therefor Method of double-side lapping a wafer and an apparatus therefor

1997-11-25

1999-11-02

Scherbel, David A.

Abrading

Machine

Rotary tool

451 41, 451262, 451268, 451 63, B24B 500

Patent

active

059759976

ABSTRACT:
A pair of ring-shaped lapping plates 13, 23 are faced to both surfaces of a wafer 1. Each lapping plate 13, 23 has an outer diameter approximately equal to a radius of the wafer 1 and a lapping surface 14, 24 sliding in contact with the wafer 1. Each lapping plate 13, 23 is rotated along a direction reverse from the other, while an abrasion slurry A is fed into cavities 15, 25 of the lapping plates 13, 23 and discharged together with dusts separated from the wafer 1 through grooves engraved in the lapping surfaces 14, 24 and gaps between the wafer 1 and the lapping surfaces 14, 24. The lapping plate 23 is carried toward the stationary lapping plate 13 at a rate corresponding to abrasion of the lapping surfaces 14, 24. During lapping, the wafer 1 is rotated by drive rollers 31 and supported by guide rollers 32. In this way, both surfaces of the wafer 1 are simultaneously lapped.

REFERENCES:
patent: 4393628 (1983-07-01), Ottman et al.
patent: 5800253 (1998-09-01), Ikemoto
IBM Technical Disclosure Bulletin--Disk substrate Polisher by Fox et al., Aug. 1983.

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