Method of dividing wafer into individual devices after...

Details Method of dividing wafer into individual devices after... Method of dividing wafer into individual devices after...

2006-11-27

2008-10-21

Huynh, Andy (Department: 2818)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C438S033000, C438S068000, C438S113000, C438S458000, C438S460000

Reexamination Certificate

active

07439162

ABSTRACT:
The present invention grinds the rear surface side of a device area to form a recessed portion and an annular reinforcement part on the outer periphery of the recessed portion, removes the annular reinforcement part by grinding or cutting the rear surface of the annular reinforcement part so as to give the wafer a uniform thickness, locates the position of streets in the front surface of the wafer by infrared imaging from the rear surface side of the wafer, and after dividing the wafer into individual devices affixes dicing tape to the rear surface of the wafer divided into devices, supports the rear surface of the wafer on a dicing frame and peels a protective member off the front surface of the wafer, thereby enabling the wafer to be supported using ordinary dicing tape while posing no obstacle to device pick-up after division of the wafer.

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