Method of dividing semiconductor wafer using ultraviolet sensiti

Details Method of dividing semiconductor wafer using ultraviolet sensiti Method of dividing semiconductor wafer using ultraviolet sensiti

1990-07-19

1993-08-24

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

432209, 432173, 432926, H01L 21302, H01L 21304

Patent

active

052388760

ABSTRACT:
A method and an apparatus for producing semiconductor devices in which a semiconductor wafer is adhered to an ultraviolet sensitive tape, the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet sensitive tape being adhered to a ring frame so that the semiconductor wafer is fixed to the ring frame with the ultraviolet sensitive tape. Successive semiconductor wafers thus fixed to respective ring frames are subjected to a series of steps including dicing, breaking, and ultraviolet irradiation for reducing the adhesiveness of the ultraviolet tape. The semiconductor wafer, broken and divided in dice and held by the ultraviolet sensitive tape with reduced adhesiveness, is sent to a next step, such as a die-bonding step.

REFERENCES:
patent: 4897141 (1990-01-01), Girard
patent: 4999242 (1991-03-01), Ishiwata et al.
"Automatic Wafer Mounting System ", Disco Abrasive Systems, DFM-A150, Nov. 1983.
"Fully Automatic, In-Line Wafer Mounting/Dicing/Cleaning System", Disco Abrasive Systems, Nov. 1983.

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