Method of dividing an adhesive film bonded to a wafer

Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier

Reexamination Certificate

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Details

C438S463000, C438S462000, C438S460000, C438S928000, C438S113000, C438S110000, C438S114000, C438S118000, C438S458000, C257S723000, C257S783000

Reexamination Certificate

active

07579260

ABSTRACT:
A method of dividing an adhesive film for die bonding which is bonded to the rear surface of a wafer having devices in a plurality of areas sectioned by dividing lines formed in a lattice pattern on the front surface, into pieces corresponding to the devices, comprising the steps of putting the adhesive film side of the wafer on the front surface of a dicing tape mounted on an annular frame; cutting the wafer whose adhesive film side has been put on the dicing tape into devices along the dividing lines and cutting the adhesive film incompletely in such a way that an uncut portion is caused to remain; and expanding the dicing tape after the cutting step to divide the adhesive film into pieces corresponding to the devices.

REFERENCES:
patent: 6638865 (2003-10-01), Tanaka
patent: 6849523 (2005-02-01), Chao et al.
patent: 6939785 (2005-09-01), Kajiyama et al.
patent: 7329564 (2008-02-01), Nakamura et al.
patent: 2004/0266138 (2004-12-01), Kajiyama et al.
patent: 2006/0030129 (2006-02-01), Ohmiya et al.
patent: 2006/0035444 (2006-02-01), Nakamura et al.
patent: 2006/0211220 (2006-09-01), Sakaya et al.
patent: 2007/0128767 (2007-06-01), Nakamura
patent: 2007/0128834 (2007-06-01), Nakamura
patent: 2007/0164073 (2007-07-01), Watanabe et al.
patent: 2000-182995 (2000-06-01), None
patent: 2002-118081 (2002-04-01), None

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