Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate
2007-08-14
2007-08-14
Lindsay, Jr., Walter (Department: 2812)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
C438S461000, C438S462000, C438S068000, C438S114000, C438S458000, C257SE21596, C257SE21599
Reexamination Certificate
active
10499292
ABSTRACT:
The present invention relates to a method for dividing a substrate into a number of individual chip parts, comprising the steps of: forming a number of chip parts in the substrate, comprising, for each chip part, of arranging recesses in the substrate for containing fluid; arranging one or more breaking grooves in the substrate along individual chip parts; applying mechanical force to the substrate to break the substrate along the breaking grooves. The invention also relates to a substrate as well as a chip part.
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Int'l Search Report for PCT/NL02/00850, Jul. 25, 2003.
Fliesler & Meyer LLP
Lindsay, Jr. Walter
Micronit Microfluidics B.V.
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