Method of disassembling resin-molded equipment

Details Method of disassembling resin-molded equipment Method of disassembling resin-molded equipment

1991-01-11

1991-08-27

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562724, 1562739, 156344, 435872, 219 1043, 219 1057, B32B 3500

Patent

active

050430351

ABSTRACT:
In a method of disassembling resin-molded equipment, a gap is formed in the boundary portion between a metal body and a resin layer disposed around the metal body in order to separate the metal body is separated from the resin layer. To form the gap, either the metal body or the resin layer may be heated, so that the gap is formed by the difference in thermal expansion between the metal body and the resin layer. Alternatively, a microorganism such as ray fungus of Nocardia is attached to the boundary portion between the metal body and the resin layer, and decomposes the resin to form the gap. Since the gap reduces the bonding strength between the metal body and the resin layer and in some cases the metal body may even separate from the resin layer, the metal body may be pulled out with ease.

REFERENCES:
patent: 2873343 (1959-02-01), Collopy
patent: 3292563 (1975-01-01), Lavins, Jr.
patent: 3662453 (1972-05-01), Meal et al.
patent: 3963417 (1976-06-01), Placek
patent: 4317986 (1982-03-01), Sullivan
patent: 4461663 (1984-07-01), Tachibang et al.

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