Method of disassembling an image sensor package

Details Method of disassembling an image sensor package Method of disassembling an image sensor package

2007-09-11

2007-09-11

Luu, Thanh X. (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

Housings

Reexamination Certificate

active

11213256

ABSTRACT:
A method of disassembling an image sensor package, which includes a substrate and a glass layer at opposite sides. The method includes the steps of: providing a film tape adhered to the glass layer; providing a vacuuming means to suck the substrate of the image sensor package; and moving the vacuuming means away from the film tape to peel the glass layer off the image sensor package.

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patent: 6661080 (2003-12-01), Glenn et al.

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