Method of direct bonding copper foils to oxide-ceramic substrate

Details Method of direct bonding copper foils to oxide-ceramic substrate Method of direct bonding copper foils to oxide-ceramic substrate

1983-12-12

1985-03-19

Godici, Nicholas P.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228124, 228198, 228219, B23K 3102

Patent

active

045054185

ABSTRACT:
Method for directly bonding copper foils having a copper oxide layer to oxide-ceramic substrates by heating the ceramic substrate covered with the copper foil in an oxygen-containing atmosphere to a temperature above the eutectic temperature of Cu and Cu.sub.2 O, but below the melting temperature of copper in a vacuum furnace at a pressure of not more than 1 mbar while maintaining a furnace atmosphere with a partial oxygen pressure between 0.001 and 0.1 mbar.

REFERENCES:
patent: 3766634 (1973-10-01), Babcock et al.
patent: 3911553 (1975-10-01), Burgess et al.
patent: 3994430 (1976-11-01), Cusano et al.

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