Method of diffusion bonding

Metal fusion bonding – Process – Using a compliant cushioning medium

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228181, 228193, 228234, 228221, B23K 1900

Patent

active

040132102

ABSTRACT:
A method of making a composite diffusion bonded structure, comprising a honeycomb panel portion made up of a honeycomb core sandwiched between two face sheets, and a load carrying structural member bonded thereto. The honeycomb core, face sheets and structural member are preassembled in a vacuum furnace so as to permit exposure of the surfaces which are to be diffusion bonded. A vacuum is drawn and the assembly is heated to near diffusion bonding temperature with the bonding surfaces still exposed to the vacuum environment. Thereafter, the bonding surfaces are brought into contact with very moderate pressure, and are maintained at a temperature and pressure sufficient for diffusion bonding. The assembly is then cooled, with the result being a substantially unitary diffusion bonded structure.

REFERENCES:
patent: 3533153 (1970-10-01), Melill et al.
patent: 3533156 (1970-10-01), Klimmek et al.
patent: 3538593 (1970-11-01), King et al.
patent: 3552898 (1971-01-01), Bird et al.
patent: 3628226 (1971-12-01), Nelson
patent: 3633267 (1972-01-01), Deminet et al.
"Process for Diffusion Welding Ti- 6A1-4V Alloy", Rehder et al., Welding Journal, May 1970, pp. 213s-218s.
"Determination of Optimum Diffusion Welding Temperatures for Ti- 6A1-4V", Keller et al., IBID, pp. 219s-224s.
Clark "Vacuum Diffusion Joining of TI," Welding Journal Research Supplement, June 1959, pp. 251s-258s.
Garrett et al., Broad Applications of Diffusion Bonding, NASA CR 409, Mar. 1966, pp. 1, 62-65.
"Titanium & Titanium Alloys; Diffusion Welding" Len Griffing, Editor, Welding Handbook, 6 Ed., 1972, Am. Welding Soc., pp. 73.43-73.46.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of diffusion bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of diffusion bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of diffusion bonding will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1952363

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.