Method of die bonding semiconductor chip by using removable non-

Details Method of die bonding semiconductor chip by using removable non- Method of die bonding semiconductor chip by using removable non-

1989-02-10

1990-12-25

Rosenbaum, Mark

Metal working

Method of mechanical manufacture

Electrical device making

29827, 29848, 357 70, H05K 302

Patent

active

049792890

ABSTRACT:
A method and apparatus for accurately positioning a semiconductor chip onto a die bond pad region of a semiconductor package. A removable non-wettable by solder frame is constructed for slidable contact with peripheral walls of a semiconductor package die cavity. A frame central aperture with a wide upper opening and a narrower lower opening guides a semiconductor chip dropped therethrough into a precise position in the die cavity.

REFERENCES:
patent: 3458780 (1969-07-01), McDaniel
patent: 3780429 (1973-12-01), Friebel et al.
patent: 4025716 (1977-05-01), Morse
patent: 4079511 (1978-03-01), Grabbe
patent: 4139726 (1979-02-01), Penrod et al.
patent: 4408218 (1983-10-01), Grabbe
patent: 4670770 (1987-06-01), Tai
patent: 4685606 (1987-08-01), Flint et al.

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