Method of die bonding semiconductor chip by using removable fram

Details Method of die bonding semiconductor chip by using removable fram Method of die bonding semiconductor chip by using removable fram

1990-10-31

1991-12-24

Gorski, Joseph M.

Metal working

Method of mechanical manufacture

Electrical device making

29827, 156299, H05K 330

Patent

active

050740369

ABSTRACT:
A method and apparatus for accurately positioning a semiconductor chip onto a die bond pad region of a semiconductor package. A frame is constructed for slidable contact with peripheral walls of a semiconductor package die cavity. A frame central aperture with a wide upper opening and a narrower lower opening guides a semiconductor chip dropped therethrough into a precise position in the die cavity.

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Machine Design Currently Available Commercially (p. 2 of the Information Disclosure Statement Filed Oct. 31, 1990, by Applicants).

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