Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1992-02-28
1993-09-07
Heinrich, Samuel M.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228195, 228231, 228254, B23K 3102, H01L 2150
Patent
active
052420990
ABSTRACT:
In a manufacturing method for a semiconductor device, first, a diffused layer of a soldering material is provided previously either on the reverse surface of a die or on the obverse surface of a die pad. Then, a diffusing layer is formed on either surface of the diffused layer. The diffusing layer between the die and the die pad is brought into contact with the die and die pad, and then these components are heated. The die is thereby and fully bonded to the die pad, even when the diffusing layer, which is an initial bonding layer, is made thinner. Because the time for the diffusing layer to diffuse can be shortened, the time for installing the die can also be shortened.
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IBM Technical Disclosure Bulletin, "Transient Liquid Phase Bonding Process", vol. 32, No. 4A, pp. 273, 274, Sep. 1989.
Transactions of the Metallurgical Society of AIME, ". . . SLID Bonding", Bernstein and Bartholomew, vol. 236, pp. 405-412, Mar. 1966.
Heinrich Samuel M.
Mitsubishi Denki & Kabushiki Kaisha
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