Method of dicing semiconductor wafer with diamond and resin blad

Details Method of dicing semiconductor wafer with diamond and resin blad Method of dicing semiconductor wafer with diamond and resin blad

1992-09-09

1993-11-30

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437249, 156645, 156657, 148DIG28, H01L 21302, H01L 21304, H01L 21463

Patent

active

052665283

ABSTRACT:
A method of dicing a semiconductor wafer for dividing a semiconductor wafer having a large number of devices formed thereon in a matrix into a large number of chips by the use of a diamond blade, includes the steps of first cutting by the use of the diamond blade in such a manner as to leave a partial residual portion or portions in a direction of thickness of the wafer and to define a plurality of grooves on the wafer in transverse and longitudinal directions, and then cutting the wafer along the grooves by the use of a resin blade having a width equal to or smaller than that of the diamond blade while a feed speed thereof is kept lower than that of the diamond blade.

REFERENCES:
patent: 4878992 (1989-11-01), Campanelli

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