Method of dicing semiconductor wafer into chips, and...

Details Method of dicing semiconductor wafer into chips, and... Method of dicing semiconductor wafer into chips, and...

2008-06-17

2008-06-17

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C438S033000, C438S068000, C438S107000, C438S113000, C257S618000, C257S622000

Reexamination Certificate

active

07387951

ABSTRACT:
The invention relates to a semiconductor wafer dicing method of dicing a semiconductor wafer along parting lines into chips. The semiconductor wafer in which parting lines along which the semiconductor wafer is diced into chips are formed is held by an adhesive tape. By radially drawing the adhesive tape in a state where the chips in the semiconductor wafer are not parted from each other, the chips are parted from each other and clearances among the chips are extended.

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Chinese Office Action for Chinese Patent Application No. 2005100562688 dated Feb. 15, 2008.

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